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键合压力对引线键合换能系统的影响

发表时间:2010-02-28  浏览量:1460  下载量:678
全部作者: 李战慧,吴运新,隆志力
作者单位: 湖南交通职业技术学院机电工程系;中南大学机电工程学院
摘 要: 利用等效电路法建立热超声引线键合(wire bonding)换能系统的机电等效电路模型,采用阻抗分析仪对不同键合压力条件下的引线键合换能系统进行测试,得到不同键合压力条件下引线键合换能系统的导纳圆图,并计算得到谐振频率、反谐振频率、机械品质因数、动态电阻和机电耦合系数等的变化规律。计算结果为引线键合换能系统键合压力的选择提供了可靠依据。实践证明,等效电路法在热超声引线键合换能系统中是有效的。
关 键 词: 机械电子;引线键合;键合压力;导纳圆;等效电路
Title: Effect of bonding pressure on wire bonding transducer system
Author: LI Zhanhui, WU Yunxin, LONG Zhili
Organization: Department of Mechanical & Electrical Engineering, Hunan Communication Polytechnic;College of Mechanical & Electrical Engineering, Central South University
Abstract: A model of wire bonding transducer system is established using equivalent circuit method. The wire bonding transducer system is tested at different bonding pressures with impedance analyzer. The admittance circle diagrams of wire bonding transducer system are obtained at different bonding pressures. And the change rules of resonance frequency, anti-resonance frequency, mechanical quality factor, dynamic resistance and electromechanical coupling coefficient etc are gotten. This explains the best bonding pressure selection from vibration principle. It is proved that equivalent circuit method is valid in thermosonic wire bonding transducer system.
Key words: mechatronics; wire bonding; bonding pressure; admittance circle; equivalent circuit
发表期数: 2010年2月第4期
引用格式: 李战慧,吴运新,隆志力. 键合压力对引线键合换能系统的影响[J]. 中国科技论文在线精品论文,2010,3(4):326-331.
 
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