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焊点形状对焊点可靠性的影响
发表时间：2009-03-15 浏览量：2346 下载量：1084
| 全部作者： | 张宇，杨雪霞，赵振东，树学峰 |
| 作者单位： | 太原理工大学应用力学与生物医学工程研究所 |
| 摘 要： | 研究了塑封焊球阵列封装器件（plastic ball grid array, PBGA）中SnPb焊点在-55℃～125℃热循环条件下的可靠性问题，分析了在高度相同、焊盘尺寸相同的情况下，焊点形状（桶形、柱形、沙漏形）对焊点可靠性的影响。用有限元方法模拟了焊点在热循环加载条件下的应力应变分布，计算了焊点的应力应变最大值，得出最外侧焊点的等效塑性应变最大、最容易失效。此外，根据有限元模拟得到的等效塑性应变值，结合修正的Coffin-Manson经验方程对3种不同形状焊点在热循环载荷下的疲劳寿命进行了预测，计算得到沙漏形焊点的疲劳寿命远大于柱形和桶型焊点的疲劳寿命。该计算结果为电子封装工艺中焊点的形状设计提供了一定理论基础。 |
| 关 键 词： | 固体力学；焊点可靠性；疲劳寿命；焊点形状；有限元方法；Coffin-Manson模型；热循环 |
| Title： | Effects of solder joint shape on joint reliability |
| Author： | ZHANG Yu, YANG Xuexia, ZHAO Zhendong, SHU Xuefeng |
| Organization： | Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology |
| Abstract： | SnPb solder joints reliability under thermal cycling conditions(-55℃~125℃) were investigated in this paper, and the effects of solder joint shape (barrel, cylinder, hourglass) on joint reliability were analyzed for the same joint height and the same copper pad size. Finite element method was used to simulate the distribution of stress and strain of solder joints, and calculate the maximum of stress and strain under thermal cycling condition, the result showed that the outmost solder joints, the equivalent strain of which was maximum, were the most likely to crack. In addition, the fatigue lives of three kinds of solder joints mentioned above were predicted using a modified Coffin-Manson empirical equation and the value of the equivalent plastic strain based on the finite element result under thermal cycling condition, the result showed that hourglass solder joints have larger fatigue lives than the cylinder and barrel solder joints. The results provided a theoretical basis for the design of the solder joints shape for electronic packaging technology. |
| Key words： | solid mechanics; solder joints reliability; fatigue life; solder joints shape; finite element method; Coffin-Manson equation; thermal cycling |
| 发表期数： | 2009年3月第5期 |
| 引用格式： | 张宇，杨雪霞，赵振东，等. 焊点形状对焊点可靠性的影响[J]. 中国科技论文在线精品论文，2009，2（5）：456-462. |
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