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电子封装用莫来石/环氧树脂纳米复合材料研究
发表时间：2009-11-30 浏览量：1734 下载量：789
| 全部作者： | 王凤清，强颖怀，赵曰健，贾志永 |
| 作者单位： | 中国矿业大学材料科学与工程学院；宁波天路进出口有限公司 |
| 摘 要： | 将钛酸酯偶联剂包覆的纳米莫来石(nano-mullite)添加到环氧树脂(epoxy resin, EP)中，借助机械搅拌和超声波分散的实验方法，制备了莫来石/EP纳米复合材料，在得出其最佳添加量及其拉伸性能比纯EP有显著提高结论的基础上，进一步表征了该新材料的热强性能、线膨胀系数、导热系数、体积电阻率、介电常数及吸水率等性能。结果发现：该新材料各项受检测性能均达到了电子封装材料的性能要求，有望取代现有的高成本EP复合材料，在电子封装领域得以应用。 |
| 关 键 词： | 复合材料；电子封装；纳米莫来石；环氧树脂 |
| Title： | Research of mullite/epoxy resin nano-composites used in electronic packaging field |
| Author： | WANG Fengqing1, QIANG Yinghuai1, ZHAO Yuejian1, JIA Zhiyong |
| Organization： | The Material Science and Engineering College, China University of Mining and Technology；Ningbo Skyway Import Export Co., Ltd. |
| Abstract： | Nano-mullite coated with titanate was added to epoxy resin(EP). With mechanical mixing and method of ultrasonic dispersion, mullite/epoxy resin nano-composite was prepared. On the basis of getting its best addition and its tensile properties being much better than pure epoxy resin, the paper further described the new material�s thermal strength property, linear expansion coefficient, thermal conductivity, volume resistivity, dielectric constant and water absorption performance. It was found that the new material�s performance which were tested in this paper could meet the require of the electronic packaging material�s. The new material was expected to replace the existing high cost epoxy composites in the field of electronic packaging who can be applied in. |
| Key words： | composite material; electronic packaging; nano-mullite; epoxy resin |
| 发表期数： | 2009年11月第22期 |
| 引用格式： | 王凤清，强颖怀，赵曰健，等. 电子封装用莫来石/环氧树脂纳米复合材料研究[J]. 中国科技论文在线精品论文，2009，2（22）：2402-2406. |
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