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电子封装用莫来石/环氧树脂纳米复合材料研究

发表时间:2009-11-30  浏览量:1473  下载量:672
全部作者: 王凤清,强颖怀,赵曰健,贾志永
作者单位: 中国矿业大学材料科学与工程学院;宁波天路进出口有限公司
摘 要: 将钛酸酯偶联剂包覆的纳米莫来石(nano-mullite)添加到环氧树脂(epoxy resin, EP)中,借助机械搅拌和超声波分散的实验方法,制备了莫来石/EP纳米复合材料,在得出其最佳添加量及其拉伸性能比纯EP有显著提高结论的基础上,进一步表征了该新材料的热强性能、线膨胀系数、导热系数、体积电阻率、介电常数及吸水率等性能。结果发现:该新材料各项受检测性能均达到了电子封装材料的性能要求,有望取代现有的高成本EP复合材料,在电子封装领域得以应用。
关 键 词: 复合材料;电子封装;纳米莫来石;环氧树脂
Title: Research of mullite/epoxy resin nano-composites used in electronic packaging field
Author: WANG Fengqing1, QIANG Yinghuai1, ZHAO Yuejian1, JIA Zhiyong
Organization: The Material Science and Engineering College, China University of Mining and Technology;Ningbo Skyway Import Export Co., Ltd.
Abstract: Nano-mullite coated with titanate was added to epoxy resin(EP). With mechanical mixing and method of ultrasonic dispersion, mullite/epoxy resin nano-composite was prepared. On the basis of getting its best addition and its tensile properties being much better than pure epoxy resin, the paper further described the new material�s thermal strength property, linear expansion coefficient, thermal conductivity, volume resistivity, dielectric constant and water absorption performance. It was found that the new material�s performance which were tested in this paper could meet the require of the electronic packaging material�s. The new material was expected to replace the existing high cost epoxy composites in the field of electronic packaging who can be applied in.
Key words: composite material; electronic packaging; nano-mullite; epoxy resin
发表期数: 2009年11月第22期
引用格式: 王凤清,强颖怀,赵曰健,等. 电子封装用莫来石/环氧树脂纳米复合材料研究[J]. 中国科技论文在线精品论文,2009,2(22):2402-2406.
 
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