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板级封装芯片面自由跌落的失效分析

发表时间:2012-02-15  浏览量:1229  下载量:594
全部作者: 白创,袁国政,树学锋
作者单位: 太原理工大学应用力学与生物医学工程研究所;太原理工大学应用力学研究所
摘 要: 采用高加速度的跌落试验方法,研究球栅阵列(ball grid array, BGA)封装在自由平面跌落冲击中的可靠性。用型号RS-DP-03A跌落台模拟真实工况下BGA封装芯片的平面跌落行为,试验中以BGA封装芯片动态电压的实时变化为基准,分析得出:随着跌落次数的增加,芯片峰值电阻值的变化经历稳态、增长和失效3个阶段。以同一高度跌落到木质基板与刚质基板上,对比分析芯片焊点失效过程,对失效封装芯片进行染色试验,观察BGA封装中焊球的失效位置和焊球内部裂纹的形态。根据观察结果分析得出:跌落撞击到钢质基板上,失效焊点有明显的疲劳失效区和断裂失效区;撞击到木质基板上失效焊点只有明显的疲劳失效区,得出不同材质的跌落撞击基板,对芯片内焊点的失效有显著影响。
关 键 词: 固体力学;电子封装;焊球失效;跌落;峰值电阻
Title: Failure analysis of board-level chip packages in free fall
Author: BAI Chuang, YUAN Guozheng, SHU Xuefeng
Organization: Institute of Applied Mechanics & Biomedical Engineering, Taiyuan University of Technology; Institute of Applied Mechanics, Taiyuan University of Technology
Abstract: High acceleration drop test method was used to study the reliability of ball grid array (BGA) packages during the plane drop-free impact process. The model RS-DP-03A drop device was used to simulate the plane falling behavior of BGA chip packages under the real conditions. In the test, based on the real-time changes of dynamic voltage, the analysis showed that three stages of steady, growth and failure were chip peak resistance changing course with the increase of dropping and times. The BGA chip packages were dropped from the same height to the wooden and steel substrates, chip solder joint failure process was analyzed comparatively. Stain tests were carried on the expired chip packages to observe the failure position of solder joints and the internal appearance of cracks. According to the observation, there were obvious fatigue failure zone and fracture failure zone when the chip impacted to steel substrate; and when the chip impacted to wooden substrate, there was just fatigue failure zoon. The result shows that there is a significant influence on the failure of chip solder joints when the materials of substrates which are dropped on are different.
Key words: solid mechanics; electronic packaging; solder failure; peak resistance
发表期数: 2012年2月第3期
引用格式: 白创,袁国政,树学锋. 板级封装芯片面自由跌落的失效分析[J]. 中国科技论文在线精品论文,2012,5(3):278-283.
 
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