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铜互联层游离磨料超精表面制造工艺中颗粒复杂作用数值分析
发表时间：2012-08-31 浏览量：1619 下载量：320
| 全部作者： | 韩雪松 |
| 作者单位： | 天津大学机械工程学院 |
| 摘 要： | 采用大规模分子动力学仿真研究固体表面与抛光颗粒之间的复杂作用及表面平坦化的物理本质。研究表明：颗粒动能及冲击角度决定了粒子传递给材料表面的能量，进而影响材料去除速率，最终创成表面是不同控制机制下的粒子行为协同作用的结果。因此，原子尺度上抛光表面应是几何离散区域集而非单一连续光滑区域。 |
| 关 键 词： | 机械制造自动化；化学机械抛光；数值分析；分子动力学；复杂行为 |
| Title： | Numerical analysis on complex mechanism about free abrasive ultraprecision surface machining of copper interconnection layer |
| Author： | HAN Xuesong |
| Organization： | School of Mechanical Engineering, Tianjin University |
| Abstract： | Large-scale classical molecular dynamic simulation of tribology interaction among nanoparticles and solid surface and the surface morphology have been carried out to investigate the complex physical essence of surface planarization. The results show that simultaneous impact of several abrasive particles or the repeated impact of abrasive particles leads to material failure. The results also justify that no single wear mechanism dominates all operating conditions, different wear mechanisms operate, with their relative importance changing as the sliding conditions change. The velocity and angle of approach of the abrasive particles will determine the kinetic energy that the particles transfer to the surface, and hence will affect removal rates. The real finished nanometric surface should be the mathematical integration of numerous discrete areas but not a continuous smooth integrity at atomic level. |
| Key words： | mechanical manufacturing automation; chemical mechanical polishing; numerical analysis; molecular dynamics; complex behavior |
| 发表期数： | 2012年8月第16期 |
| 引用格式： | 韩雪松. 铜互联层游离磨料超精表面制造工艺中颗粒复杂作用数值分析[J]. 中国科技论文在线精品论文，2012，5（16）：1499-1502. |
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