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Ti3Al1.2-xSnxC1.9(x=0.1~0.4)固溶体材料的制备及性能

发表时间:2013-05-15  浏览量:1096  下载量:313
全部作者: 黄振莺,许浩,翟洪祥,刘晓涵,李萌启
作者单位: 北京交通大学机械与电子控制工程学院
摘 要: 以Ti,Al,Sn和C(石墨)元素粉为原料,采用原位热压烧结法制备了高纯度的Ti3Al1.2-xSnxC1.9(x=0,0.1,0.2,0.3,0.4)层间固溶体陶瓷块体材料,研究合成温度对产物纯度的影响,测试分析制备材料的相组成及显微结构,测试制备材料的密度、电阻率、抗弯强度和断裂韧性等特性。结果表明:在1 450~1 500℃之间,都能得到高纯高致密的Ti3Al1.2-xSnxC1.9(x=0.1~0.4)块体材料,Sn的加入降低了Ti3AlC2的烧结温度;微观结构为典型的板状晶,晶粒内部的层状结构清晰可见;随着Sn含量的增加,固溶体材料的密度增大,抗弯强度降低,而电阻率基本保持不变。
关 键 词: 无机非金属材料;Ti3Al1.2-xSnxC1.9;固溶体;显微结构;材料性能
Title: Preparation and properties of Ti3Al1.2-xSnxC1.9 (x=0.1-0.4) solid solutions
Author: HUANG Zhenying, XU Hao, ZHAI Hongxiang, LIU Xiaohan, LI Mengqi
Organization: School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University
Abstract: High purity Ti3Al1.2-xSnxC1.9(x=0, 0.1, 0.2, 0.3, 0.4) layered solid solution ceramics have been fabricated by in-situ hot-pressing from titanium, aluminum, tin and graphite elemental powders. The effect of the synthesi temperature on the purity of the product, the phase composition and the microstructure of the product were analyzed, also the density, electrical resistivity, flexural strength and fracture toughness were measured.The results showed that, in the temperature range of 1 450-1 500℃, high purity Ti3Al1.2-xSnxC1.9(x=0.1-0.4)solid solutions could be obtained. The added Sn reduced the sintering temperature. A typical plate-like shape of grains and layered structure could be seen clearly from SEM micrographs. With the increase of Sn content, the density of Ti3Al1.2-xSnxC1.9(x=0.1-0.4)solid solution increased, the flexural strength decreased and the electrical resistivity essentially unchanged.
Key words: inorganic non-metallic material; Ti3Al1.2-xSnxC1.9; solid solution; microstructure; material propertiers
发表期数: 2013年5月第9期
引用格式: 黄振莺,许浩,翟洪祥,等. Ti3Al1.2-xSnxC1.9(x=0.1~0.4)固溶体材料的制备及性能[J]. 中国科技论文在线精品论文,2013,6(9):857-862.
 
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