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东京电子VIGUS型号干刻反应腔颗粒物增多机理研究

发表时间:2017-03-31  浏览量:2038  下载量:2316
全部作者: 汤介峰,黄其煜
作者单位: 上海交通大学电子信息与电气工程学院;上海华力微电子有限公司
摘 要: 围绕东京电子(TEL)VIGUS型号干刻反应腔颗粒物增多的问题展开研究。该型号反应腔所负责的制程是55 nm大马士革一体化刻蚀工艺,在没有业界经验的情况下,通过实验数据分析,确定了门板连杆密封圈老化是导致反应腔颗粒物异常增多的原因。并对密封圈老化的3个原因:氧、温度和机械摩擦的影响进行深入分析,最终通过采取对使用时间管控、更改密封圈材质和改善机械摩擦来杜绝门板密封圈的老化问题,有效控制了颗粒物的产生,提高了机台2%以上的使用率。在后续工作中,计划通过寻找更好材质的密封圈、持续改善工艺条件来延长密封圈的使用寿命,使机台使用率再提高5%以上。
关 键 词: 材料失效与保护;密封圈;门板连杆;颗粒物
Title: Study on the mechanism of particles increasing in dry etch chamber on TEL VIGUS machine
Author: TANG Jiefeng, HUANG Qiyu
Organization: School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University; Shanghai Huali Microelectronics Corporation
Abstract: This paper is a mechanism study for particles increasing problem in dry etch chamber on TEL VIGUS machine. This type of chamber is responsible for the process of 55 nm Damascus integrated etching process. Without industry experience, we determine particles increasing is due to the aging of o-ring in shutter shaft by the analysis of experiments data. Through in-depth analysis of the three causes for o-ring aging: effect of oxygen, temperature and mechanical friction, we take the use of uptime control, changing the o-ring materials and improving mechanical friction to avoid the aging problem of o-ring in shutter shaft, and finally we can control particles increasing effectively as well as increase the machine uptime for more than 2%. In the follow-up work, we plan to increase more than 5% uptime by looking for better o-ring materials and improving the process conditions continuously to extend the life time of shutter shaft o-ring.
Key words: materials failure and protection; o-ring; shutter shaft; particle
发表期数: 2017年3月第6期
引用格式: 汤介峰,黄其煜. 东京电子VIGUS型号干刻反应腔颗粒物增多机理研究[J]. 中国科技论文在线精品论文,2017,10(6):642-648.
 
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