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IGBT模块焊料层故障易发部位探究

发表时间:2018-08-31  浏览量:130  下载量:35
全部作者: 吴寒江,王浩轩
作者单位: 国网冀北电力有限公司廊坊供电公司
摘 要: 以绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)功率模块为开关器件,不断地通断操作,使其经受温度和应力的反复冲击,模块的性能将不断退化,可靠性逐渐降低。针对IGBT的可靠性,通过仿真探究的方法,分析模块在运行过程中焊料层的温度与热应力分布,研究得出较易发生焊料层故障的部位,从而为模块退化情况的分析评估提供一种有效的方法。研究对于IGBT模块的安全可靠性运行具有重要意义。
关 键 词: 半导体技术;IGBT功率模块;可靠性;焊料层;老化
Title: Research on faulty parts of solder layer in IGBT module
Author: WU Hanjiang, WANG Haoxuan
Organization: State Grid Langfang Power Supply Company, State Grid Jibei Electric Power Company
Abstract: The insulated gate bipolar transistor (IGBT) power module is used as a switching device undergone the repeated impact of temperature and stress through constantly on-off operation, then the performance of the module will continue to degrade, so that its reliability is gradually reduced. According to the reliability of IGBT, the temperature and thermal stress distribution of solder layer during the operation of the module are analyzed by simulation, and the parts of solder layer, which are more prone to failure, are obtained. An effective method for the analysis and evaluation of module degradation is provided, which is of great significance for the safe and reliable operation of IGBT module.
Key words: semiconductor technology; IGBT power module; reliability; solder layer; degradation
发表期数: 2018年8月第16期
引用格式: 吴寒江,王浩轩. IGBT模块焊料层故障易发部位探究[J]. 中国科技论文在线精品论文,2018,11(16):1686-1690.
 
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