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IGBT模块封装用基板材料的研究现状

发表时间:2019-08-30  浏览量:183  下载量:16
全部作者: 黄义炼,傅仁利
作者单位: 南京航空航天大学材料科学与技术学院
摘 要: 绝缘栅双极型晶体管(insulating gate bipolar transistor,IGBT)模块封装用基板材料由金属和陶瓷复合而成。由于两种材料的物化性质相差很大,其连接和成功连接后的基板可靠性均存在很大的问题。金属和陶瓷材料之间难以润湿,热膨胀系数相差较大,是其难以连接和冷热循环下基板失效的主要原因。本文综述了当下适合于IGBT模块封装用的不同金属材料及陶瓷材料的连接方式,以及连接后基板的可靠性,为IGBT模块封装用基板材料的选择提供一定的参考。
关 键 词: 材料合成与加工工艺;绝缘栅双极型晶体管;综述;基板;封装;可靠性
Title: Review of IGBT module packaging substrate material
Author: HUANG Yilian, FU Renli
Organization: College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics
Abstract: Insulating gate bipolar transistor (IGBT) module packaging substrate material is made of metal and ceramic. Because the physicochemical properties of the two materials are quite different, there are big problems in their connection and the reliability of the substrate after successful connection. It is difficult to wetting between the metal and ceramic materials, and the difference of thermal expansion coefficient is large, which make the connection between metal and ceramic become difficult, and are the reasons for the failure of the substrate under thermocycling. The different ways of connecting the metal materials and ceramic materials, which is suitable for IGBT module packaging, and the reliability of substrate after connection are reviewed in this paper. It provides some references for the selection of IGBT module packaging substrate material.
Key words: material synthesizing and processing technics; insulating gate bipolar transistor; review; substrate; packaging; reliability
发表期数: 2019年8月第4期
引用格式: 黄义炼,傅仁利. IGBT模块封装用基板材料的研究现状[J]. 中国科技论文在线精品论文,2019,12(4):602-609.
 
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